Contact
Ms. Zhang Lanying
Email: lanyingz@fudan.edu.cn
Tel: +86-21-61050229
Research Groups
RF & Analog IC Design Group
A young establishment of 2016 as the RF & analog IC design group is, its research findings have been accepted by the International Solid-State Circuit Conference (ISSCC) for 2 consecutive years (2018 and 2019). ISSCC is the top conference crowned as the IC Olympic Games by academic and industrial affirmation.
At present, the group is undertaking a major project funded by the Shanghai Science and Technology Commission: Multi-channel wireless neural recording system. The goal of this project is to study and design a multi-channel high-integration chip that can be applied to detect animal neural signals. Previously, the group undertook another major project titled Brain science and brain-like artificial intelligence funded by the Shanghai Science and Technology Commission. The group’s schievements have been praised by high-level leaders of Fudan University.
The research spectrum (including but not limited to) spans across:
•Analog chip design: high-performance analog front-end amplifier, power management module, wireless energy harvesting module, etc.
•Hybrid chip design: high-performance and energy-efficient clock circuit, all-digital phase-locked loop, high-performance and energy-efficient analog digital converter (ADC), high-speed I/O interface circuit (a.k.a SerDes), wirelined transceiver and time-domain-based mixed signal convolution neural networks, etc.
•RF chip design: energy-efficient transceivers for the Internet of Things, energy-efficient radar transceivers for gesture recognition, high-performance RF front-ends, etc.
Digital and System Group
The focus of the group is the design, implementation and verification of high-energy efficiency ultra-large scale digital integrated circuits and systems based on advanced technology. Its projects include brain-inspired chip and on-chip system, artificial intelligence processor based on high energy efficiency neural network mapping method, etc. Its core research areas are the neural network accelerator data flow planning, architecture design, the neural network compression method and sparse research of deep learning, the quantitative method of neural networks, neural-network-oriented reconfigurable hardware design and process development, design of neural network systems for application and design of advanced neural network accelerators.
At present, the group is conducting research on AI accelerator chips, IP and complete tool sets for deep learning neural networks in artificial intelligence application.
Algorithm and System Group
This group focuses on the application and development of AI algorithms and system integration, including subjects of computer vision and natural language processing. Currently this group is responsible for four projects. The first one is a collaborative project with Zhongshan Hospital, a Fudan affiliate. This project aims to utilize computer vision algorithms to help doctors identify patient with potential neurological diseases. The second project targets finding the potential network consensus and analyzing the popular events in social media. This project needs cross-disciplinary knowledge, for which experts from six different university departments are invited. The third project uses computer vision algorithms to help researchers in mapping the mouse brain. The fourth project is the compiler design for a mixed-signal reconfigurable AI accelerator.
The algorithm and system group centers research focuses on AI algorithms and system design for AI accelerators. The ongoing projects are Human Pose Estimation, Multiple Object Tracking, Event Detection and Retrieval, Sentiment Analysis, etc., covering some best-known unsolved problems in computer vision and natural language processing.
Microelectronics Packaging Research Group
Microelectronics packaging is an interdisciplinary area of study combining solid mechanics, structural analysis, materials, electronics and circuits, heat transfer, fluid mechanics, manufacturing, design, test and reliability. By using multidisciplinary resources and advanced micro/nano-fabrication to deliver high speed, high frequency, 3D packaging and multifunctional system integration, the group aims to develop advanced packaging with features of miniaturization, high density, high integration and high reliability to improve device performance while reduce losses. The group develops microelectronics packaging solutions and processes for applications including brain-inspired computing systems, intelligent wearable devices, RF, 5G, etc.
The research spectrum (including but not limited to) spans across:
•Design/ Process/ Test/ Reliability of Integrated Circuit Packaging: packaging process design, thermal design and thermal management, advanced electronic material application, multiphysics modeling and simulation, failure analysis, etc.
•RF MEMS Design/ Process/ Packaging: different passive components applied in wireless communication, such as high-Q resonator, filter, RF MEMS switches, micro-antenna, micro-inductor, capacitor, etc.
•Wafer-Level 3D Packaging: TSV, 2.5D interposer, 3D IC, fan-out, multichip heterogeneous integration, etc.
Faculty
Ye Dawei received a B.Sc. degree in optoelectronics in 2008 from the Huazhong University of Science and Technology, Wuhan, China, and the M.Sc degree in 2012 in electrical engineering from Lund University, Sweden. Since 2016 he has been a research associate at the Institute of Brain-Inspired Circuits and Systems (IBICAS), Fudan University. During 2012-2016, he has been a research assistant in the IC Design Group, University of Twente, the Netherlands. His current research interests include interferer-robust ultralow power transceiver, phase-lock loop (PLL), wireless power harvesting and RF front-ends.
Lyu Liangjian received a Bachelor’s degree in physics in 2010 from Nanjing University, China, and the Master’s degree in Microelectronics and Solid-State Electronics in 2013 from Fudan University. From 2013 to 2016, he worked as an analog/mixed-signal design engineer in Telink Semiconductor, Shanghai, China. He is currently working as a research associate at Institute of Brain-Inspired Circuits and Systems (IBICAS), Fudan University. His research interests include analog and mixed-signal integrated-circuit design for biomedical applications.
Zhang Yiyun is an assistant researcher of IBICAS, Fudan University. Now her main research focus is integrated circuit verification. From 2010 to 2015, she participated in the Project of Manufacturing Technology and Complete Sets of Technology for Very Large Scale Integrated Circuits, national program on key basic research and development (973 program & super 973 program), the national natural science foundation of high performance phase change storage technology project, responsible for the serial peripheral interface (SPI) phase change memory chip design. In July 2015, she obtained the doctor of science degree in microelectronics and solid-state electronics from Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. Later, she worked as an assistant researcher in the research center of special integrated circuit brain chips of Fudan University, engaged in frontline scientific research and management.
Zou Qiaosha, graduated with a PhD from the Pennsylvania State University in 2015, major in Computer Science and Engineering. She joined IBICIAS in 2018, and was a lecturer at Zhejiang University of Science and Technology during 2016-2018. Before then, she worked as a research engineer at Huawei's Shannon Laboratory. Her research interests include application of AI algorithm, computer architecture, and compiler design for accelerator.
Xu Ling has been working for IBICAS as an assistant professor since 2017, leading the microelectronics packaging team. Cooperating closely with the Analogue and RF Electronics Research Team, her team now focuses on developing electronic packaging solutions and processes for intelligent wearable devices, brain-inspired computing system and RF devices, especially the design of RF MEMS and 2.5D/3D packaging based on multiphysics modeling and simulation methods. Ling received her Ph.D degree in mechanical engineering from the Huazhong University of Science and Technology in 2016. Her research interests are microelectronics and power packaging. She has published over 10 peer-reviewed journal and conference papers as the first or corresponding author, and has been issued 6 invention patents.
International Cooperation
IBICAS understands the importance of global exchanges and sharing of knowledge. Staff and students are sent abroad annually for short-term visits. IBICAS annually hosts overseas guests for visits, and holds international conferences each year. Meanwhile, IBICAS works actively in partnership with a number of internationally well-known research organizations and companies worldwide.
IBICAS has established long-term ties with many state-funded research institutions, universities and companies in such countries as the United States, the United Kingdom, Germany, Japan, Singapore, etc. It has academic links with numerous leading domestic research institutions and universities such as the Institute of Automation Chinese Academy of Sciences, the Institute of Semiconductors, the Institute of Microelectronics (IME) of the Chinese Academy of Sciences (CAS).
As part of the institution’s effort for national and international collaboration, it has launched a wide range of joint projects where the Institute has partnered with Shanghai Science and Technology Commission Innovation Fund, State Key Laboratory of ASIC and System, the School of Microelectronics Fudan University, State Key Laboratory of Medical Neurobiology and MOE Frontiers Center for Brain Science, the Institute of Semiconductors, etc.
This has enhanced not only the opening-up of IBICAS, but also its R&D work and reputation in the international community.
